Advanced Technical Ceramics

Advanced ceramic devices are key components in many technical systems. They affect the performance profiles of entire products decisively and are therefore of vital interest.

Department 5.5 focuses on development and characterisation of ceramic tapes and multilayer in sensors, power engineering, high frequency electronics, telecommunication, micro-systems and biotechnology. Many years of experience in materials development, processing and testing of multilayer devices are our distinguished qualification. We improve industrially manufactured components with regard to safety and reliability and we perform innovative research projects.

Areas of competence

Testing of ceramic materials and components

• Granulometry (round-robin tests, development of certified standard materials)
• Slurry testing (viscosimetry, acoustic spectrometry, particle charge detection)
• Green tape characterisation (defect detection, tensile strength, compressibility)
• Inspection of microstructure and surface (acoustic microscopy, laser scanning microscopy, helium leakage rate testing)
• Determination of electric, dielectric and magnetic properties (permittivity, dielectric loss, dielectric strength, permeability, electric resistivity)

Tape casting and multilayer technology

• Tape casting (laboratory and pilot scale production)
• Multilayer processing (design, punching, hot-knife cutting, screen printing, uniaxial and isostatic lamination, hot embossing)
• Sintering technology (sintering press, hydrogen and inert gas furnaces)

Development of materials and components

• Glasses
• Low Temperature Co-fired Ceramics (LTCC)
• High Temperature Co-fired Ceramics (HTCC)
• Highly integrated multilayer with electrical and optical functions, cavities, channels, porous structures

Joining of ceramics

• Mo-Mn-process
• Reactive air brazing
• Low-temperature joining (< 300 °C) based on silver pastes

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